The Resource Copper interconnect technology, Christoph Steinbruche, Barry Chin

Copper interconnect technology, Christoph Steinbruche, Barry Chin

Label
Copper interconnect technology
Title
Copper interconnect technology
Statement of responsibility
Christoph Steinbruche, Barry Chin
Creator
Contributor
Author
Publisher
Subject
Language
eng
Summary
Copper interconnect technology is expected to be a key component in the quest to create more powerful CPUs and memory chips. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found
Member of
Cataloging source
SPIES
Dewey number
621.381/046
Illustrations
illustrations
Index
index present
LC call number
TK7870.15
LC item number
.S74 2001eb
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
Series statement
Tutorial texts in optical engineering
Series volume
v. TT46
Target audience
adult
Label
Copper interconnect technology, Christoph Steinbruche, Barry Chin
Publication
Note
"SPIE Digital Library."--Website
Antecedent source
file reproduced from original
Bibliography note
Includes bibliographical references (pages 103-117) and index
http://library.link/vocab/branchCode
  • net
Carrier category
online resource
Carrier MARC source
rdacarrier
Color
black and white
Content category
  • still image
  • text
Content type MARC source
  • rdacontent
  • rdacontent
Contents
1. Introduction: Acknowledgments -- 2. Interconnect issues: 2.1. Overview; 2.2. Materials requirements; 2.3. Materials options; 2.4. Multilevel interconnect fabrication -- 3. Copper deposition: 3.1. Overview; 3.2. Chemical deposition methods for copper; 3.3. Physical deposition methods for copper -- 4. Copper patterning: 4.1. Overview; 4.2. Subtractive copper patterning; 4.3. Additive copper patterning by chemical-mechanical polishing (CMP) -- 5. Interlayer dielectrics: 5.1. Silicate-based ILDs; 5.2. Organic polymer-based ILDs; 5.3. Patterning of ILDs -- 6. Cu/ILD barriers: 6.1. Cu/undoped-SiO2 barriers; 6.2. Cu/doped-SiO2 barriers; 6.3. Cu/polymerbarriers -- 7. Current practice: 7.1. Overview; 7.2. Preclean; 7.3. Barrier layers; 7.4. Copper fill methods; 7.5. Future directions -- References -- Index
Control code
ocn985344603
Dimensions
unknown
Extent
1 online resource (viii, 122 pages)
Form of item
online
Isbn
9781510608030
Media category
electronic
Media MARC source
isbdmedia
Other control number
10.1117/3.2265078
Other physical details
illustrations
http://library.link/vocab/recordID
.b36997419
Specific material designation
remote
System control number
  • (OCoLC)985344603
  • spie1510608036

Library Locations

    • Deakin University Library - Geelong Waurn Ponds CampusBorrow it
      75 Pigdons Road, Waurn Ponds, Victoria, 3216, AU
      -38.195656 144.304955
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